This paper presents a miniaturized transformer-based ultra-low-power (ULP) LC-VCO with embedded supply pushing reduction techniques for IoT applications in 65-nm CMOS process. To reduce the on-chip area, a compact transformer patterned ground shield (PGS) is implemented. The transistors with switchable capacitor banks and associated components are placed underneath the transformer, which further shrinking the on-chip area. To lower the power consumption of VCO, a gm-stacked LC-VCO using the transformer embedded with PGS is proposed. The transformer is designed to provide large inductance to obtain a robust start-up within limited power consumption. Avoiding implementing an off/on-chip Low-dropout regulator (LDO) which requires additional voltage headroom, a low-power supply pushing reduction feedback loop is integrated to mitigate the current variation and thus the oscillation amplitude and frequency can be stabilized. The proposed ULP TF-based LC-VCO achieves phase noise of -114.8dBc/Hz at 1MHz frequency offset and 16kHz flicker corner with a 103µW power consumption at 2.6GHz oscillation frequency, which corresponds to a -193dBc/Hz VCO figure-of-merit (FoM) and only occupies 0.12mm2 on-chip area. The supply pushing is reduced to 2MHz/V resulting in a -50dBc spur, while 5MHz sinusoidal ripples with 50mVPP are added on the DC supply.

In this paper the transfer function of a system with windowed current integration is discussed. This kind of integration is usually used in a sampling mixer and the current is generated by a transconductance amplifier (TA). The parasitic capacitance (Cp) and the output resistance of the TA (Ro,TA) before the sampling mixer heavily affect the performance. Calculations based on a model including the parasitic capacitance and the output resistance of the TA is carried out. Calculation results show that due to the parasitic capacitance, a notch at the sampling frequency appears, which is very harmful because it causes the gain near the sampling frequency to decrease greatly. The output resistance of the TA makes the depth of the notches shallow and decreases the gain near the sampling frequency. To suppress the effect of Cp and Ro,TA, an operational amplifier is introduced in parallel with the sampling capacitance (Cs). Simulation results show that there is a 17 dB gain increase while Cs is 1,pF, gm is 9,mS, N is 8 with a clock rate of 800,MHz.

This paper introduces a high-resolution and compact CMOS switch-type phase shifter (STPS) for the 5th generation mobile network (5G) n260 band. In this work, totally four coarse phase shifting stages and a high-resolution tuning stage are included. The coarse stages based on the bridged-T topology is capable of providing 202.5° phase coverage with a 22.5° tuning step. To further improve the phase shifting resolution, a compact fine-tuning stage covering 23° is also integrated with the coarse stages. Sub-degree phase shifting resolution is realized for supporting the fine beam-steering and high-accuracy phase calibration in the 5G new radio. Simplified phase control algorithm and suppressed insertion loss can also be maintained by the proposed fine-tuning stage. In the measurement, the achieved RMS gain errors at 39 GHz are 0.1 dB and 0.4 dB for the coarse stages and fine stage, respectively. The achieved RMS phase errors at 39 GHz are 3.1° for the coarse stages and 0.1° for the fine stage. Within 37 GHz to 40 GHz, the measured return loss within all phase-tuning states is always better than -14 dB. The proposed phase shifter consumes a core area of only 0.12mm2 with 65-nm CMOS process, which is area-efficient.

This paper proposes a novel wideband voltage-controlled oscillator (VCO) for multi-band transceivers. The proposed oscillator has a core VCO and a tuning-range extension circuit, which consists of an injection-locked frequency divider (ILFD) and flip flop dividers. The two-stage differential ILFD generates quadrature outputs and realizes two, three, four, and six of divide ratio with very wide output frequency range. The proposed circuit is implemented by using a 90 nm CMOS process, and the chip area is 250200 µm2. The measured result achieves continuous frequency tuning range of 9.3 MHz-to-5.7 GHz (199%) with -210 dBc/Hz of figure-of-merit (FoMT).

This paper proposes a de-embedding method for on-chip S-parameter measurements at mm-wave frequency. The proposed method uses only two transmission lines with different length. In the proposed method, a parasitic-component model extracted from two transmission lines can be used for de-embedding for other-type DUTs like transistor, capacitor, inductor, etc. The experimental results show that the error in characteristic impedance between the different-length transmission lines is less than 0.7% above 40 GHz. The extracted pad model is also shown.

A 60-GHz power amplifier (PA) with a reliability consideration for a hot-carrier-induced~(HCI) degradation is presented. The supply voltage of the last stage of the PA ($V_{{ m PA}}$) is dynamically controlled by an on-chip digitally-assisted low drop-out voltage regulator (LDO) to alleviate HCI effects. A physical model for estimation of HCI degradation of NMOSFETs is discussed and investigated for dynamic operation. The PA is fabricated in a standard 65-nm CMOS process with a core area of 0.21,mm$^{2}$, which provides a saturation power of 10.1,dBm to 13.2,dBm with a peak power-added efficiency~(PAE) of 8.1% to 15.0% for the supply voltage $V_{{ m PA}}$ which varies from 0.7,V to 1.0,V at 60,GHz, respectively.

This paper presents a physical layer wireless device identification method that uses a convolutional neural network (CNN) operating on a quadrant IQ transition image. This work introduces classification and detection tasks in one process. The proposed method can identify IoT wireless devices by exploiting their RF fingerprints, a technology to identify wireless devices by using unique variations in analog signals. We propose a quadrant IQ image technique to reduce the size of CNN while maintaining accuracy. The CNN utilizes the IQ transition image, which image processing cut out into four-part. An over-the-air experiment is performed on six Zigbee wireless devices to confirm the proposed identification method's validity. The measurement results demonstrate that the proposed method can achieve 99% accuracy with the light-weight CNN model with 36,500 weight parameters in serial use and 146,000 in parallel use. Furthermore, the proposed threshold algorithm can verify the authenticity using one classifier and achieved 80% accuracy for further secured wireless communication. This work also introduces the identification of expanded signals with SNR between 10 to 30dB. As a result, at SNR values above 20dB, the proposals achieve classification and detection accuracies of 87% and 80%, respectively.

This paper discusses the design and performance of on-chip passive components of transmission lines (TR) and inductors. First, the measurement technique of on chip passives is discussed. A transmission line that can be used for Gbps signal propagation on Si CMOS is examined. As a high density transmission line structure of diagonal-pair differential TR line is described. Also, a circuit and TR line is introduced for above 10 Gbps signal propagation. The on-chip inductor which is a key passive component in RF application of Si CMOS technology is discussed. We examine some on-chip inductors that have been developed in our group: small area inductor, high performance inductor using WL-CSP (Wafer-Level Chip-Size-Packaging) technology. Finally, a wide tuning range LC-VCO using a variable inductor for RF reconfigurable circuit is introduced.

An all-digital fully-synthesizable PVT-tolerant clock data recovery (CDR) architecture for wireline chip-to-chip interconnects is presented. The proposed architecture enables the co-synthesis of the CDR with the digital core. By eliminating the resource hungry manual layout and interfacing steps, which are necessary for conventional CDR topologies, the design process and the time-to-market can be drastically improved. Besides, the proposed CDR architecture enables the re-usability of majority of the sub-systems which enables easy migration to different process nodes. The proposed CDR is also equipped with a self-calibration scheme for ensuring tolerence over PVT. The proposed fully-syntehsizable CDR was implemented in 28nm FDSOI. The system achieves a maximum data rate of 10.06Gbps while consuming a power of 16.1mW from a 1V power supply.

Interconnect Length Distribution (ILD) represents the correlation between the number of interconnects and their length. The ILD can predict power consumption, clock frequency, chip size, etc. High core utilization and small circuit area have been reported to improve chip performance. We propose an ILD model to predict the correlation between core utilization and chip performance. The proposed model predicts the influences of interconnect length and interconnect density on circuit performances. As core utilization increases, small and simple circuits improve the performances. In large complex circuits, decreasing the wire coupling capacitance is more important than decreasing the total interconnect length for improvement of chip performance. The proposed ILD model expresses the actual ILD more accurately than conventional models.

There are enlarged requirements of millimeter-wave beamforming phased-array transceivers and high-order modulation multi-input multi-output (MIMO) transceivers. High-performance integrated RF switches are regarded as one of the most critical components for those transceivers to support signal channel distribution and path redundancy. This paper introduces a CMOS high-isolation and low-loss RF switch with a novel switched parallel LC resonance network. The proposed single-pole double-throw (SPDT) RF switch realizes 68dB port isolation and 1.0dB insertion loss with an active area of 0.034mm2. The SPDT RF switch is composed of two series-shunt transistor pairs with body-floating technology and a switched parallel LC network. The network uses a turned-off series transistor to resonate out off-capacitance Coff. The measured output third-order intercept (OIP3) is higher than 21dBm. The proposed SPDT RF switch maintains return losses of all working ports less than 10dB from 8GHz to 20GHz. The high-performance SPDT RF switch is fabricated in standard 65-nm CMOS technology.

This paper presents a 20 GHz push-push VCO realized by a 10 GHz super-harmonic coupled quadrature oscillator for a quadrature 60 GHz frequency synthesizer. The output nodes are peaked by a tunable second harmonic resonator. The proposed VCO is implemented in 65 nm CMOS process. It achieves a tuning range of 3.5 GHz from 16.1 GHz to 19.6 GHz with a phase noise of -106 dBc/Hz at 1 MHz offset. The power consumption of the core oscillators is 10.3 mW and an FoM of -181.3 dBc/Hz is achieved.

An L-2L through-line de-embedding method has been verified up to millimeter wave frequency. The parasitics of the pad can be modeled from the L-2L through-line. Measurement results of the transmission lines and transistors can be de-embedded by subtracting the parasitic matrix of the pad. Therefore, the de-embedding patterns, which is used for modeling active and passive devices, decrease greatly and the chip area also decreases. A one-stage amplifier is firstly implemented for helping verifying the de-embedding results. After that a four-stage 60 GHz amplifier has been fabricated in CMOS 65 nm process. Experimental results show that the four-stage amplifier realizes an input matching better than -10.5 dB and an output matching better than -13 dB at 61 GHz. A small signal power gain of 16.4 dB and a 1 dB output compression point of 4.6 dBm are obtained with a DC current consumption of 128 mA from a 1.2 V power supply. The chip size is 1.5 mm 0.85 mm.

This paper concerns a new model for estimating the wire length distribution (WLD) of a system-on-a-chip (SoC). The WLD represents the correlation between wire length and the number of interconnects, and we can predict circuit performances such as power consumption, maximum clock frequency, and chip size from the WLD. A WLD model considering core utilization has been proposed, and the core utilization has a large impact on circuit performance. However, the WLD model can treat only a one-function circuit. We propose a new WLD model considering core utilization to estimate the wire length distribution of SoC, which consists of several different-function macroblocks. We present an optimization method to determine each core utilization of macroblocks.

This paper proposes a dual-conduction class-C VCO for ultra-low supply voltages. Two cross-coupled NMOS pairs with different bias points are employed. These NMOS pairs realize an impulse-like current waveform to improve the phase noise in the low supply conditions. The proposed VCO was implemented in a standard 0.18 µm CMOS technology, which oscillates at a carrier frequency of 4.5 GHz with a 0.2-V supply voltage. The measured phase noise is -104 dBc/Hz@1 MHz-offset with a power consumption of 114 µW, and the FoM is -187 dBc/Hz.

This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90directional coupler using the WL-CSP technology has center frequency of 25.6 GHz, insertion loss of -0.5 dB and isolation of -29.8 dB in the measurement result. The WL-CSP technology contributes to realize low-loss RF passive devices on Si CMOS chip, which is indispensable to achieve small-size, cost-effective and low-power monolithic wireless communication circuits (MWCCs).

This paper presents a high power efficient pulse VCO with tail-filter for the chip-scale atomic clock (CSAC) application. The stringent power and clock stability specifications of next-generation CSAC demand a VCO with ultra-low power consumption and low phase noise. The proposed VCO architecture aims for the high power efficiency, while further reducing the phase noise using tail filtering technique. The VCO has been implemented in a standard 45nm SOI technology for validation. At an oscillation frequency of 5.0GHz, the proposed VCO achieves a phase noise of -120dBc/Hz at 1MHz offset, while consuming 1.35mW. This translates into an FoM of -191dBc/Hz.

This paper presents a high jitter performance injection-locked clock multiplier (ILCM) using an ultra-low power (ULP) voltage-controlled oscillator (VCO) for IoT application in 65-nm CMOS. The proposed transformer-based VCO achieves low flicker noise corner and sub-100µW power consumption. Double cross-coupled NMOS transistors sharing the same current provide high transconductance. The network using high-Q factor transformer (TF) provides a large tank impedance to minimize the current requirement. Thanks to the low current bias with a small conduction angle in the ULP VCO design, the proposed TF-based VCO's flicker noise can be suppressed, and a good PN can be achieved in flicker region (1/f3) with sub-100µW power consumption. Thus, a high figure-of-merit (FoM) can be obtained at both 100kHz and 1MHz without additional inductor. The proposed VCO achieves phase noise of -94.5/-115.3dBc/Hz at 100kHz/1MHz frequency offset with a 97µW power consumption, which corresponds to a -193/-194dBc/Hz VCO FoM at 2.62GHz oscillation frequency. The measurement results show that the 1/f3 corner is below 60kHz over the tuning range from 2.57GHz to 3.40GHz. Thanks to the proposed low power VCO, the total ILCM achieves 78 fs RMS jitter while using a high reference clock. A 960 fs RMS jitter can be achieved with a 40MHz common reference and 107µW corresponding power.

Analysis of resonance frequency in shorted transmission lines with inserted capacitor has been made. The analysis shows a resonance frequency dependence on capacitance position on a shorted transmission line. Two analysis methods are presented to predict the resonance frequency and understand how the inserted capacitor affects the resonance frequency of the shorted transmission line. Using this knowledge we propose a new structure for digital controlled oscillators utilizing the capacitance's sensitivity dependence on position of the shorted transmission line to increase the frequency resolution. A 9 GHz transmission line based digital controlled oscillator was designed and fabricated as a proof of concept. Measured results show that more than 100 times frequency step resolution increase is possible utilizing the same tuning capacitor size located at different points on the transmission line.

This paper introduces several design techniques to improve the performance of CMOS frequency multipliers that operate at the sub-THz band without increasing the complexity and the power consumption of the circuit. The proposed techniques are applied to a device nonlinearity-based frequency tripler and to a push-push frequency doubler. By utilizing the fundamental and second harmonic feedback cancellation, the tripler achieves -2.9dBm output power with a simple single-ended circuit architecture reducing the required area and power consumption. The tripler operates at frequencies from 103GHz to 130GHz. The introduced modified push-push doubler provides 2.3dB conversion gain including the balun losses and it has good tolerance against balun mismatches. The output frequency of the doubler is from 118GHz to 124GHz. Both circuits were designed and fabricated using CMOS 65nm technology.